Transistors - RF, Mosfets, Misc.
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POTC Book, Principles of Transistor Circuits, 8th Edition S.W. Amos
$46.91Out of stock
POTC Book, Principles of Transistor Circuits, 8th Edition
Introduction and guide to the design of amplifiers, function generators, receivers and digital circuits. 394 pages. Paperback.
Contents: Semiconductors and Junction Diodes, Basic Principles of Transistors, Common-base and Common-gate Amplifiers, Common-emitter and Common-source Amplifiers, Common-Collector and Common-Drain Amplifiers, Bias and DC stabilisation, Small-Signal AF Amplifiers, DC and Pulse Amplifers, RF and IF amplifiers, etc.
ISBN 0-7506-1999-6
Author: S.W. Amos
Limited Quantity Available, New Old Stock
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Type Z9 GC Electronics 10-8109 Heatsink Compound Large 1oz.Tube Thermal Grease
$9.91Heat Sink Compound is silicone-based thermal grease made from a silicone fluid thickened with metal oxide fillers.
Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.
For mounting transistors, diodes, rectifiers and resistors. Thermal joint compound for any device where efficient cooling is desired.
MFR: GC Electronics, USA
SKU: 10-8109Made in the USA -
251 Thermalcote Joint Compound (Thermal grease) 1 lb Metal Can (NOS)
$31.91 -
Type Z9 GC Electronics Heatsink Compound 10-8108 Thermal Grease 6.5 grams
$5.91Heat Sink Compound is silicone-based thermal grease made from a silicone fluid thickened with metal oxide fillers.
BENEFITS AND FEATURES: Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.
MAJOR APPLICATIONS: Mounting transistors, diodes, rectifiers and resistors. Thermal joint compound for any device where efficient cooling is desired.
MFR: GC Electronics, USA
MFR Part #: 10-8108
SKU: Type-Z9Made in the USA
