Heat Sink Compound is silicone-based thermal grease made from a silicone fluid thickened with metal oxide fillers.
BENEFITS AND FEATURES: Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.
MAJOR APPLICATIONS: Mounting transistors, diodes, rectifiers and resistors. Thermal joint compound for any device where efficient cooling is desired.
MFR: GC Electronics, USA
MFR Part #: 10-8108
SKU: Type-Z9Made in the USA