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Thermal Grease

Thermal Grease

Thermal grease is a thermally conductive compound used to enhance the heat transfer between two surfaces. It fills microscopic imperfections and irregularities on surfaces, ensuring better thermal contact. Ideal for applications in electronics and machinery, it improves cooling efficiency and prolongs device lifespan.

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Type Z9 GC Electronics Heatsink Compound 10-8108 Thermal Grease 6.5 grams
Type Z9 GC Electronics Heatsink Compound 10-8108 Thermal Grease 6.5 grams
Made in the USA

In Stock

$5.91

Heat Sink Compound is silicone-based thermal grease made from a silicone fluid thickened with metal oxide fillers.


BENEFITS AND FEATURES: Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.


MAJOR APPLICATIONS: Mounting transistors, diodes, rectifiers and resistors. Thermal joint compound for any device where efficient cooling is desired.


MFR: GC Electronics, USA
MFR Part #: 10-8108
SKU: Type-Z9

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Type Z9 GC Electronics 10-8109 Heatsink Compound Large 1oz.Tube Thermal Grease
Type Z9 GC Electronics 10-8109 Heatsink Compound Large 1oz.Tube Thermal Grease
Made in the USA

In Stock

$9.91

Heat Sink Compound is silicone-based thermal grease made from a silicone fluid thickened with metal oxide fillers.


Grease-like consistency; opaque white in color; zero bleed; very stable at elevated temperatures; excellent thermal resistance and high thermal conductivity; efficient thermal coupler; effective and positive heat sink sealers and heat transfer agent. The product offers high thermal conductivity, virtually no bleed or evaporation over a wide operating temperature range. It will not harden, dry out or melt after 1,000 hours at 200°C. Meets Mil-C-47009 and Mil-C-47113.


For mounting transistors, diodes, rectifiers and resistors. Thermal joint compound for any device where efficient cooling is desired.


MFR: GC Electronics, USA
SKU: 10-8109

Add to Cart

2 Item(s)